Best Fiber Optic Modem Factory – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink

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Best Fiber Optic Modem Factory – ECMM, DOCSIS 3.0, 2xGE, 2xMCX, SA120IE – MoreLink Detail:

Product Detail

The MoreLink’s SA120IE is a DOCSIS 3.0 ECMM Module (Embedded Cable Modem Module) supporting up to 8 downstream and 4 upstream bonded channels to deliver a powerful high-speed Internet experience.

The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment.

Base on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also can be used as a Spectrum Analyzer.

This product specification covers DOCSIS® and EuroDOCSIS® 3.0 versions of the Embedded Cable Modem Module series of products. Throughput this document, it will be referred as SA120IE.The SA120IE is temperature hardened for integration in other products that are required to operate in the outdoor or extreme temperature environment. Based on Full Band Capture (FBC) function, SA120IE is not only a Cable Modem, but also it can be used as a Spectrum Analyzer (SSA-Splendidtel Spectrum Analyzer). Heatsink is mandatory and application specific. Three PCB holes are provided around the CPU, so that a heatsinking bracket or similar device can be affixed to the PCB, to transfer the generated heat away from the CPU and towards the housing and environment.

Product Features

➢ DOCSIS / EuroDOCSIS 3.0 compliant

➢ 8 downstream x 4 upstream bonded channels

➢ Support Full Band Capture

➢ Two MCX (Female) connectors for Downstream and Upstream

➢ Two 10/100/1000 Mbps Ethernet Ports

➢ Standalone External Watchdog

➢ Temperature sensor on board

➢ Accurate RF power level (+/-2dB) at all temperature range

➢ Embedded Spectrum Analyzer (Range: 5~1002 MHz)

➢ DOCSIS MIBs, SCTE HMS MIBs supported

➢ Software upgrade by HFC network

➢ Support SNMP V1/V2/V3

➢ Support baseline privacy encryption (BPI/BPI+)

➢ Small size (dimensions): 136mm x 54mm

Application

➢ Transponder: Fiber Node, UPS, Power Supply.

Technical Parameters

Protocol Support
DOCSIS/EuroDOCSIS 1.1/2.0/3.0 SNMP v1/v2/v3 TR069
Connectivity
RF: MCX1, MCX2		Two MCX Female, 75 OHM, Straight Angle, DIP
Ethernet Signal/PWR: J1, J2		1.27mm 2×17 PCB Stack, Straight Angle, SMD 2xGiga Ethernet Ports
RF Downstream
Frequency (edge-to-edge)		88~1002 MHz (DOCSIS) 108~1002 MHz (EuroDOCSIS)
Channel Bandwidth		6 MHz (DOCSIS) 8 MHz (EuroDOCSIS) 6/8 MHz (Auto Detection, Hybrid Mode)
Modulation		64QAM, 256QAM
Data Rate		Up to 400 Mbps by 8 Channel bonding
Signal Level		Docsis: -15 to +15 dBmV Euro Docsis: -17 to +13 dBmV (64QAM); -13 to +17 dBmV (256QAM)
RF Upstream
Frequency Range		5~42 MHz (DOCSIS) 5~65 MHz (EuroDOCSIS) 5~85 MHz (Optional)
Modulation		TDMA: QPSK,8QAM,16QAM,32QAM,64QAM S-CDMA: QPSK,8QAM,16QAM,32QAM,64QAM,128QAM
Data Rate		Up to 108 Mbps by 4 Channel Bonding
RF Output Level		TDMA (32/64 QAM): +17 ~ +57 dBmV TDMA (8/16 QAM): +17 ~ +58 dBmV TDMA (QPSK): +17 ~ +61 dBmV S-CDMA: +17 ~ +56 dBmV
Networking
Network protocol		IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 and L3)
Routing		DNS / DHCP server / RIP I and II
Internet Sharing		NAT / NAPT / DHCP server / DNS
SNMP version		SNMP v1/v2/v3
DHCP server		Built-in DHCP server to distribute IP address to CPE by CM’s Ethernet port
DCHP client		CM automatically gets IP and DNS server address from MSO DHCP server
Mechanical
Dimensions		56mm (W) x 113mm (L)
Environmental
Power Input		Support wide power input: +12V to +24V DC
Power Consumption		12W (Max.) 7W (TPY.)
Operating Temperature		Commercial: 0 ~ +70 ^oC Industrial: -40 ~ +85 ^oC
Operating Humidity		10~90% (Non Condensing)
Storage Temperature		-40 ~ +85 ^oC

Board-to-Board Connectors between Digital and CM Board

There’re two boards: Digital board and CM Board, which use four pairs of board-to-board connectors to transmit RF signals, Digital signals and power.

Two pairs of MCX connectors used for DOCSIS Downstream and Upstream RF Signals. Two pairs of Pin Header/PCB Socket used for Digital Signals and Power. CM board is placed under the Digital Board. CM’s CPU is contacted to the housing through thermal pad to transfer the heat away from CPU and towards the housing and environment.

The mated height between two boards is 11.4+/-0.1mm.

Here’s the illustration of matched board-to-board connection:

1 (7)

Note:

Cause of Board-to-Board design for two PCBA Boards, in order to make sure stable and reliable connection, therefore, when

To design the Housing, it should be taken the assembly engineering and screws for fix into consideration.

J1, J2: 2.0mm 2×7 PCB Socket, Straight Angle, SMD

J1: Pin Definition (Preliminary)

J1 Pin	CM Board Female, PCB Socket	Digital Board Male, Pin Header	Comments
1	GND
2	GND
3	TR1+		Giga Ethernet Signals from CM board. There’s NO Ethernet transformer on the CM board, here’re Only the Ethernet MDI Signals to Digital Board. RJ45 and Ethernet transformer are placed at Digital Board.
4	TR1-
5	TR2+
6	TR2-
7	TR3+
8	TR3-
9	TR4+
10	TR4-
11	GND
12	GND
13	GND		Digital board provides Power to CM board, the power level range is; +12 to +24V DC
14	GND

J2: Pin Definition (Preliminary)

J2 Pin	CM Board Female, PCB Socket	Digital Board Male, Pin Header	Comments
1	GND
2	Reset		Digital board can send a reset signal to CM board, then to reset the CM. 0 ~ 3.3VDC
3	GPIO_01		0 ~ 3.3VDC
4	GPIO_02		0 ~ 3.3VDC
5	UART Enable		0 ~ 3.3VDC
6	UART Transmit		0 ~ 3.3VDC
7	UART Receive		0 ~ 3.3VDC
8	GND
9	GND		0 ~ 3.3VDC
10	SPI MOSI		0 ~ 3.3VDC
11	SPI CLOCK		0 ~ 3.3VDC
12	SPI MISO		0 ~ 3.3VDC
13	SPI Chip Select 1		0 ~ 3.3VDC
14	GND