China Wholesale Modem Docsis 3.0 With Router Products – Fiber Node Transponder, SA120IE – MoreLink

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China Wholesale Modem Docsis 3.0 With Router Products – Fiber Node Transponder, SA120IE – MoreLink Detail:

Cable Modem Features

▶DOCSIS/EURODOCSIS 1.1/2.0/3.0, Channel bonding: 8*4
▶Two MCX (Female) connectors for Downstream and Upstream
▶Provide two-Port Giga Ethernet MDI Signals to target board (Digital Board) through J1 & J2
▶Get DC Power Supply from Target Board by use of J2
▶Standalone External Watchdog
▶Temperature sensor on board
▶Small size (dimensions): 113mm x 56mm
▶Accurate RF power level 2dB at all temperature range
▶FBC for Spectrum Analyzer, integrated Splendidtel Spectrum Analyzer (SSA)
▶Support Low Power Mode and Full Function Mode Switchable

SW Features

▶DOCSIS^®/Euro-DOCSIS^® HFC environment auto detection
▶UART/I2C/SPI/GPIO driver customization for various devices monitoring. Such as Fiber node, Power Supply, RF Amplifier
▶Docsis MIBs / Any other customized MIB support
▶Open system API and data structure for 3^rd party application’s access
▶Low power signal detection. Signal lower than -40dBmV will be represented with built-in Spectrum Analyzer
▶CM MIB Files are open for customers
▶CM management Web GUI is available on WAN or LAN
▶MSO can reboot the CM remotely via Telnet or SNMP
▶Switchable between Bridge and Router mode
▶Supports DOCSIS device upgrade MIB

System Block

Morelink Product Specification-SA120IE Rev.01_201809192092

External Watchdog

An external watchdog is used to make sure the system’s operation reliably. Watchdog is kicked by the
Firmware every once in a while, so that the CM does not reset. If there’s something wrong with the CM
Firmware, then after a certain period (watchdog time), the CM will reset automatically.

Morelink Product Specification-SA120IE Rev.01_201809192408

Technical Parameters

Protocol Support
◆ DOCSIS/EuroDOCSIS 1.1/2.0/3.0◆ SNMP v1/v2/v3◆ TR069
CPU and Memory
CPU	BCM33838M (8×4, Commercial, 0 ~ +70 ^oC)BCM3383DI (8×4, Industrial, -40 ~ +85 ^oC)
Memory	64MB DDR3
Flash	8MB SPI Flash
Connectivity
RF: MCX1, MCX2		Two MCX Female, 75 OHM, Straight Angle, DIP
Ethernet Signal/PWR: J1, J2		1.27mm 2×17 PCB Stack, Straight Angle, SMD2xGiga Ethernet Ports
RF Downstream
Frequency (edge-to-edge)		◆ 88~1002 MHz (DOCSIS)◆ 108~1002 MHz (EuroDOCSIS)
Channel Bandwidth		◆ 6 MHz (DOCSIS)◆ 8 MHz (EuroDOCSIS)◆ 6/8 MHz (Auto Detection, Hybrid Mode)
Modulation		64QAM, 256QAM
Data Rate		Up to 400 Mbps by 8 Channel bonding
Signal Level		Docsis: -15 to +15 dBmVEuro Docsis: -17 to +13 dBmV (64QAM); -13 to +17 dBmV (256QAM)
RF Upstream
Frequency Range		◆ 5~42 MHz (DOCSIS)◆ 5~65 MHz (EuroDOCSIS)◆ 5~85 MHz (Optional)
Modulation		TDMA: QPSK,8QAM,16QAM,32QAM,64QAMS-CDMA: QPSK,8QAM,16QAM,32QAM,64QAM,128QAM
Data Rate		Up to 108 Mbps by 4 Channel Bonding
RF Output Level		TDMA (32/64 QAM): +17 ~ +57 dBmVTDMA (8/16 QAM): +17 ~ +58 dBmVTDMA (QPSK): +17 ~ +61 dBmVS-CDMA: +17 ~ +56 dBmV
Networking
Network protocol		IP/TCP/UDP/ARP/ICMP/DHCP/TFTP/SNMP/HTTP/TR069/VPN (L2 and L3)
Routing		DNS / DHCP server / RIP I and II
Internet Sharing		NAT / NAPT / DHCP server / DNS
SNMP version		SNMP v1/v2/v3
DHCP server		Built-in DHCP server to distribute IP address to CPE by CM’s Ethernet port
DCHP client		CM automatically gets IP and DNS server address from MSO DHCP server
Mechanical
Dimensions		56mm (W) x 113mm (L)
Environmental
Power Input		Support wide power input: +12V to +24V DC
Power Consumption		12W (Max.)7W (TPY.)
Operating Temperature		Commercial: 0 ~ +70 ^oC Industrial: -40 ~ +85 ^oC
Operating Humidity		10~90% (Non Condensing)
Storage Temperature		-40 ~ +85 ^oC

Board-to-Board Connectors between Digital and CM Board

There’re two boards: Digital board and CM Board, which use four pairs of board-to-board connectors to transmit RF signals, Digital signals and power.

Two pairs of MCX connectors used for DOCSIS Downstream and Upstream RF Signals. Two pairs of Pin Header/PCB Socket used for Digital Signals and Power. CM board is placed under the Digital Board. CM’s CPU is contacted to the housing through thermal pad to transfer the heat away from CPU and towards the housing and environment.

The mated height between two boards is 11.4+/-0.1mm.
Here’s the illustration of matched board-to-board connection:

Morelink Product Specification-SA120IE Rev.01_201809194904

Note:
Cause of Board-to-Board design for two PCBA Boards, in order to make sure stable and reliable connection, therefore, when

To design the Housing, it should be taken the assembly engineering and screws for fix into consideration.

MCX1, MCX2: 75 OHM, Female, Straight Angle, DIP

MCX1: DS

MCX2: US

Morelink Product Specification-SA120IE Rev.01_201809195214

Matched MCX Male: 75 OHM, Male, Straight Angle, DIP

Morelink Product Specification-SA120IE Rev.01_201809195269

J1, J2: 2.0mm 2×7 PCB Socket, Straight Angle, SMD

J1: Pin Definition (Preliminary)

J1 Pin	CM Board Female, PCB Socket	Digital Board Male, Pin Header	Comments
1	GND
2	GND
3	TR1+		Giga Ethernet Signals from CM board. There’s NO Ethernet transformer on the CM board, here’re Only the Ethernet MDI Signals to Digital Board. RJ45 and Ethernet transformer are placed at Digital Board.
4	TR1-
5	TR2+
6	TR2-
7	TR3+
8	TR3-
9	TR4+
10	TR4-
11	GND
12	GND
13	GND		Digital board provides Power to CM board, the power level range is; +12 to +24V DC
14	GND

J2: Pin Definition (Preliminary)

J2 Pin	CM Board Female, PCB Socket	Digital Board Male, Pin Header	Comments
1	GND
2	Reset		Digital board can send a reset signal to CM board, then to reset the CM. 0 ~ 3.3VDC
3	GPIO_01		0 ~ 3.3VDC
4	GPIO_02		0 ~ 3.3VDC
5	UART Enable		0 ~ 3.3VDC
6	UART Transmit		0 ~ 3.3VDC
7	UART Receive		0 ~ 3.3VDC
8	GND
9	GND		0 ~ 3.3VDC
10	SPI MOSI		0 ~ 3.3VDC
11	SPI CLOCK		0 ~ 3.3VDC
12	SPI MISO		0 ~ 3.3VDC
13	SPI Chip Select 1		0 ~ 3.3VDC
14	GND